Technical Information
Follow the links below for more information:
- JEDEC Thermal Test Standards
- Semiconductor Thermal Testing Principles
- Why Thermal Testing?
- Power Cycling Methodology
Microsoft PowerPoint Presentations
- Trends in Electronics Reliability Testing - Download
- Fundamentals of Transient and Steady State Component Characterization(2011) - Download
- Compact RC Models for Transient Thermal Response - Download
Application Notes
- Thermal Resistance Measurement for Hybrids & Multi-Chip Packages - Download
- Junction Temperature Accuracy Analysis - Download
- Heating Curve and Structure Function Analysis Example
- Rjc Determination with Transient Method, JEDEC 51-14
- Common Questions and Issues with Application of JEDEC 51-14
Papers
- Component Thermal Characterization:Transient to Steady State (2018) - Download
- J. W. Sofia, "Analysis of Thermal Transient Data with Synthesized Dynamic Models for Semiconductor Devices," IEEE Comp., Hybrids, Manufact. Tech., vol. 18, no. 1, pp. 39-47, March. 1995 - Download
- J. W. Sofia, "Electrical Temperature Measurement Using Semiconductors," Electronics Cooling, vol. 3, no. 1, pp. 22-25, Jan. 1997 - Download
- J. W. Sofia, "Fundamentals of Accelerated Aging of Semiconductor Devices with Power Cycling", April 2017 - Download