Semiconductor Thermal Analyzer Test-Lab Services

Component Thermal Test Services

Analysis Tech offers complete test-lab services for thermal characterization on customer-supplied components. All thermal test services meet the requirements of JEDEC No. 51 Standards and MIL STD 750E and 883. All Analysis Tech thermal product capabilities are available for contract test service. Test results are reported in tabular and graphical formats with typical turnaround times of 1-2 weeks.

Steady-state thermal resistance measurements

Steady-state thermal resistance measurements such as junction-to-ambient, junction-to-case, junction-to-board, psi-jt, and junction-to-lead are available for all devices types. For each test, up to three different reference sites can be utilized simultaneously. A complete range of fixturing and environmental conditions are also available for use including still air, forced convection, liquid immersion, Rjc fixtures (junction-to-case, air or liquid cooled, and Rjb fixturing (junction-to-board).

Die attachment evaluation

Die attachment evaluation is available for large or small lots. Data from these screening tests are provided in a text-file format along with histogram plots. Data for serialized lots can be tagged with device serial numbers. Options exist for pass/fail-screening or bin-sorting and bagging according to die attachment quality, based on customer requirements.

Heating characterization

Heating characterization and impedance simulation test services are available for comprehensive evaluation of transient thermal behavior. Transient thermal RC models are derived from the transient thermal response of the device under test, and can provide insight into the internal thermal performance of the device. Plots for time-constant spectrum and structure function are also provided. Device impedance plots as a function of heating-cycle-frequency and duty-factor for square waves or arbitrary waveforms are also offered.