JEDEC 51 Standards
The Phase 12 Thermal Analyzer and accessories conform to applicable JEDEC thermal test standards embodied in JESD51.
The JEDEC thermal test standards may be downloaded (free) from:: Get Jedec Standards
The titles of the most commonly used standards are listed below.
JEDEC Standard JESD51, Methodology for the Thermal Measurement of Component Packages
JEDEC Standard JESD51-1, Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)
JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
JEDEC Standard JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
JEDEC Standard JESD51-4, Thermal Test Chip Guideline (Wire Bond Type Chip) Contents
JEDEC Standard JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms
JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
JEDEC Standard JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
JEDEC Standard JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
JEDEC Standard JESD51-10, Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
JEDEC Standard JESD51-11, Test Boards for Through-Hole Area Array Leaded Package Thermal Measurement
JEDEC Standard JESD51-14, Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-case of Semiconductor Devices with Heat Flow Through a Single Path
Additional Standards can be found on the JEDEC web site.