CTE Chip Chuck: Precision Expansion Analysis for Microelectronics

Thermal Expansion mismatch between microchips and substrates is a common driver of solder joint fatigue and fractures. Quantifying the precise expansion characteristics of semiconductor components prior to board-level integration is essential for mitigating field failures and improving long-term product reliability.

The CTE Chip Chuck is a specialized fixture for the CTE-360 Tester (dilatometer), engineered to measure the linear (in-plane) thermal expansion of leadless semiconductor packages. The fixture consists of a high-conductivity metal chuck that aligns a quartz displacement rod with the package within the test chamber.

Key Features

• • Test Methodology: Follows ASTM E696 and ASTM E228 protocols.
  • Chip Size: Supports device packages from 3 mm to 13 mm.
  • Mechanical Precision: Ensures consistent sample orientation and placement to maintain data repeatability.
  • Design: Optimized for leadless semiconductor packages to ensure high-accuracy characterization of in-plane expansion.

By implementing the CTE Chip Chuck, engineers can obtain the empirical data necessary to align material properties and prevent mechanical failures in the field.

Maximum Sample size: 13mm x 13mm x 2mm*
*Custom chuck sizes available to accommodate different chip sizes.

The CTE-360 Tester can also be used to measure any solid material as well as some viscous liquid materials with the Liquid Sample Holder.