Analysis Tech

Electronics Reliability Testers - Semiconductor Thermal Analyzers, Event Detectors, TIM Testers, CTE Testers

(781) 245-7825
info@analysistech.com

  • Home
  • Products
    • Event Detectors
    • Semiconductor Thermal Analyzers
    • Material Thermal Testers
  • About Us
  • Downloads
  • Sales Agents
  • News
  • Contact

Coefficient of Thermal Expansion Measurement Case Study

The following example illustrates a typical material coefficient of thermal expansion test using the Analysis Tech CTE Tester. The material tested is a yellow silicone material of the type commonly used in electronic packaging. This material was subjected to a total temperature span of 70°C in two discrete temperature 'bands' (25°C to 60°C & 60°C to 95°C). Steady-state thermal equilibrium was attained at each temperature 'step' (25°C, 60°C, and 90°C), with the temperature and linear displacement measured and recorded between each temperature plateau.

The software generated a plot of Displacement vs Temperature showing the change in total material length at each temperature, and generated a plot of Displacement vs Time showing that the material had sufficient time to reach steady-state thermal equilibrium at each temperature.

The overall coefficient of thermal expansion (CTE) value for this sample, from 25°C to 95°C was 184.9 x 10-6/°C (μ-inch/°C).

CTE-360 Example Test Data

[CTE-360 Test Summary #1]
Sample ID= Yellow Silicone
Sample Length= 2.015 inches
Raw Data File= 177-15-23-x1_CTE.dat
CTE: 1=25°C to 95°C: 184.9 x 10-6/ °C +/- 3.2%
CTE: 2=25°C to 60°C: 184.0 x 10-6/ °C +/- 3.5%
CTE: 3=60°C to 95°C: 185.8 x 10-6/ °C +/- 3.5%
Date/Time= 03-21-2016/19:41:17 S/N:1160220 WinCTE V1.0.0

the coefficient of thermal expansion is plotted as change in temperature versus linear displacement or the change in material legth

the Analysis Tech coefficient of thermal expansion tester plots displacement vs time to make sure the material under test reaches steady state at a given temperature before changing temperature to measure material linear expansion

The Importance of Thermal Cycling

The initial temperature point and final temperature point should be the same to ensure that the sample returns to the original dimension.  If not, issues such as stress-relaxation, dimensional creep, or phase-change may be occurring. If the sample fails to substantially return to the original length, annealing the sample to relieve internal stresses (oven-soaking at or above the maximum CTE temperature) for an hour or more can be beneficial.

When testing a new material, general best-practice is to perform a few temperature cycles to accurately assess inelastic/plastic behavior associated with stress relaxation and dimensional creep.  These issues generally become more severe for materials closer to their melting or softening temperature.  Cyclic testing is shown in the following plots.

Material Thermal Testers

  • TIM Testers
  • CTE Tester

CTE Testers

  • CTE Tester Features
  • CTE-360 Specifications
  • CTE Technical Information
  • Thermal Expansion Test Service
  • CTE Case-Study Example

CTE Accessories

  • CTE Tester Liquid Sample Holder
  • CTE Tester Thin Sample Holder
  • CTE Chip Chuck
  • CTE-360 Draft Shield

Find An International Sales Agent

We have International Sales Agents throughout the world. Click here to see a list of all of our International Sales Agents.

Find Sales Agents

Copyright © 2026 Analysis Tech, Inc. All rights reserved.

Wakefield, MA USA | (781) 245-7825 | E-mail: info@analysistech.com