Technical Information

Interconnect Reliability Standard EIA/IPC J-STD-029 - Link to IPC
Interconnect Reliability Standard IPC-SM-785: "Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments" - View Excerpts
Interconnect Reliability Standard JESD21-B111: "Board Level Drop Test Method of Components for Handheld Electronic Products"
Interconnect Reliability Standard IPC-9701: "Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments" - View Excerpts
Connector Reliability Test Standards: EIA-364-46, EIA-364-87, and other EIA test standards
Special Application Test Requirements
Application Notes and engineering support - Contact Us

Solder Joint Failure (technical article by Werner Engelmaier)
Application Note: "Overcoming Environmental Noise" - Contact Us
Application Note: "Designing Test Boards for STD Series Event Detectors" - Contact Us
Application Note: Interconnect Reliability Issues (Engelmaier) - Download
Example Application: PBGA Testing (Motorola) - Download
Extensive library of specific Application Notes - Contact Us

W. Engelmaier, "Solder Joint Design for Reliability" - Download
L. R. Fox, J. W. Sofia, and M. C. Shine, "Investigation of Solder Fatigue Acceleration Factors", IEEE Comp., Hybrids, Manufact. Tech., vol. CHMT-8, no. 2, pp. 275-282, June 1985 - Download
Jeffrey Schutt, "Accelerate Interconnect Reliability Tests", Test & Measurement World, pp. 45-47, Sept. 1994 - Download
J. W. Sofia, "Connector Reliability Testing: A Dualism of Testing Needs", Connection Technology, pp. 41-43, Aug. 1986 - Download
S. Dunwoody, E. Bock, J. Sofia, "A Practical and Reliable Method for Detection of Nanosecond Intermittency", Amp Journal of Technology, vol. 5, pp. 54-59, Jun. 1996 - Download