Our Event Detector Product Line
Introduction & Overview
Event Detectors support the growing need for electrical-interconnection reliability testing including solder joint reliability testing. Electrical interconnect designs are evolving in response to cost, density, and reliability considerations. Additionally, the operating environment for many electronic systems is becoming more harsh due to thermal/mechanical cycling, shock, and vibration. Interconnect testing for reliability is a vital link to ensuring robust electronic systems and avoiding premature system malfunction due to electrical interconnect failures. The growing importance of this type of testing has helped to make Analysis Tech a leader in packaging reliability test systems.
Event Detectors electrically monitor the test samples to detect short duration resistance changes during accelerated aging or stress testing. Large numbers of channels are continuously monitored for sub-microsecond (to nanosecond) resistance variations under integrated software control. This type of testing is vital to ensuring interconnect-reliability in the telecommunications, automotive, aerospace, and medical industries. All Analysis Tech Event Detectors conform to JEDEC standard JESD 22-B111(depending on settings). The STD Event Detector conforms to IPC standards IPC-SM-785 and IPC-9701 for solder joint reliability testing.
- A wide range of test specifications
- Automatic data collection and analysis
- Robust immunity to false failure-data
- surface mount solder joints
- separable/mating connectors
- electromechanical relays
- non-soldered electrical connections
- flexible cables and flex-print printed circuits
- thermal cycling
- drop-testing / shock
- mechanical flexure
- mate/unmate cycling
- medical (implants)
Electrical interconnect degradation and malfunction can be caused by stress-induced crack growth, micro-motion, thermal effects, metallurgical reactions, chemical reactions, and fretting corrosion phenomena. These effects are generally studied through stress testing or accelerated aging while monitoring the interconnects for changes in electrical resistance. The initial manifestations of the onset of electrical failure are usually short duration resistance changes. Such fluctuations can cause malfunctions in modern high-speed circuitry which utilize such interconnects.
Analysis Tech Event Detectors span the range of test requirements from 1 nanosecond to 10 milliseconds, resistances from 10 milliohms to 10 megohms, interrogating currents from 10 microamps to 100 milliamps and above. Analysis Tech also offers complete, integrated laboratory test systems. Turnkey systems with up to 1024 channels are available for long-term, unattended testing. We invite requests for new or custom instruments to service test specifications not already covered by our existing standard products. Other common names for Event Detectors include: connector reliability testers, chatter detectors, glitch detectors, solder joint testers, solder joint reliability testers, solder reliability testers, and interconnect reliability testers.