Our Event Detector Product Line
Introduction & Overview
As electronic systems become more compact, cost-sensitive, and performance-driven, the demand for reliable electrical interconnections—including solder joints—continues to grow. At the same time, products are increasingly exposed to harsh operating conditions, including thermal cycling, mechanical stress, shock, and vibration. Ensuring interconnect reliability is critical to preventing premature system failures and maintaining long-term performance.
Event Detectors from Analysis Tech are purpose-built to meet this challenge. They provide continuous electrical monitoring of test samples during accelerated aging and stress testing, enabling precise detection of short-duration resistance changes that indicate early-stage failures.
With the ability to monitor large numbers of channels simultaneously, Event Detectors capture resistance variations at sub-microsecond to nanosecond resolution—all under integrated software control. This ensures that even the most transient degradation-induced events are detected, recorded, and analyzed with confidence. Widely used across telecommunications, automotive, aerospace, and medical industries, Event Detectors play a vital role in validating interconnect reliability in mission-critical applications.
All Analysis Tech Event Detectors are designed to comply with major industry standards, including JEDEC JESD22-B111 (configuration-dependent). The STD Event Detectors meet IPC-SM-785 and IPC-9701 requirements for solder joint reliability testing. Other Event Detector models address industry test standards including EIA-364-46, EIA-364-87 and other EIA test standards—helping establish Analysis Tech as a trusted leader in packaging reliability test solutions.
These turnkey, multi-channel systems offer:
- A wide range of test specifications
- Automatic data collection and analysis
- Robust immunity to false failure-data
Typical types of interconnects tested:
- surface mount solder joints
- separable/mating connectors
- electromechanical relays
- non-soldered electrical connections
- flexible cables and flex-print printed circuits
Typical environmental test conditions:
- thermal cycling
- drop-testing / shock
- mechanical flexure
- vibration
- mate/unmate cycling
Typical industry applications:
- telecommunications
- automotive
- aerospace
- military
- medical (implants)
Electrical interconnect degradation and malfunction can be caused by stress-induced crack growth, micro-motion, thermal effects, metallurgical reactions, chemical reactions, and fretting corrosion phenomena. These effects are generally studied through stress testing or accelerated aging while monitoring the interconnects for changes in electrical resistance. The initial manifestations of the onset of electrical failure are usually short duration resistance changes. Such fluctuations can cause malfunctions in modern high-speed circuitry which utilize such interconnects.
Analysis Tech Event Detectors span the range of test requirements from 1 nanosecond to 10 milliseconds, resistances from 10 milliohms to 10 megohms, interrogating currents from 10 microamps to 100 milliamps and above. Analysis Tech also offers complete, integrated laboratory test systems. Turnkey systems with up to 1024 channels are available for long-term, unattended testing. We invite requests for new or custom instruments to service test specifications not already covered by our existing standard products. Other common names for Event Detectors include: connector reliability testers, chatter detectors, glitch detectors, solder joint testers, solder joint reliability testers, solder reliability testers, and interconnect reliability testers.