Technical Information

Follow the links below for more information:

• JEDEC Thermal Test Standards
• Semiconductor Thermal Testing Principles
• Why Thermal Testing?
• Power Cycling Methodology

Microsoft PowerPoint Presentations

• Trends in Electronics Reliability Testing - Download
• Fundamentals of Transient and Steady State Component Characterization(2011) - Download
• Compact RC Models for Transient Thermal Response - Download

Application Notes

• Thermal Resistance Measurement for Hybrids & Multi-Chip Packages - Download
• Junction Temperature Accuracy Analysis - Download
• Heating Curve and Structure Function Analysis Example
• Rjc Determination with Transient Method, JEDEC 51-14
• Common Questions and Issues with Application of JEDEC 51-14

Papers

• Component Thermal Characterization:Transient to Steady State (2011) - Download
• J. W. Sofia, "Analysis of Thermal Transient Data with Synthesized Dynamic Models for Semiconductor Devices," IEEE Comp., Hybrids, Manufact. Tech., vol. 18, no. 1, pp. 39-47, March. 1995 - Download
• J. W. Sofia, "Electrical Temperature Measurement Using Semiconductors," Electronics Cooling, vol. 3, no. 1, pp. 22-25, Jan. 1997 - Download
• J. W. Sofia, "Fundamentals of Accelerated Aging of Semiconductor Devices with Power Cycling", April 2017 - Download